H10W 76/43
Gaseous fillings
H10W76/43 (Gaseous fillings) appears on 81 US grants and 99 published applications in this corpus.
Search patents in H10W- Granted patents
- 81
- Published applications
- 99
- Assignees
- 72
- Inventors
- 206
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 0 | 3 |
| 2003 | 3 | 0 |
| 2004 | 1 | 1 |
| 2005 | 1 | 6 |
| 2006 | 1 | 4 |
| 2007 | 2 | 3 |
| 2008 | 2 | 0 |
| 2009 | 1 | 0 |
| 2010 | 0 | 2 |
| 2011 | 1 | 1 |
| 2012 | 1 | 1 |
| 2013 | 1 | 1 |
| 2014 | 2 | 3 |
| 2015 | 1 | 0 |
| 2016 | 3 | 7 |
| 2017 | 3 | 5 |
| 2018 | 10 | 10 |
| 2019 | 5 | 8 |
| 2020 | 4 | 6 |
| 2021 | 4 | 8 |
| 2022 | 6 | 6 |
| 2023 | 5 | 7 |
| 2024 | 8 | 6 |
| 2025 | 3 | 5 |
| 2026 | 2 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device31 Mar 2026US 12,593,725 B2Innolux Corporation
- Integrated circuit packages to minimize stress on a semiconductor die27 Jan 2026US 12,538,804 B2Analog Devices International Unlimited Company
- Semiconductor device including a plurality of dielectric materials between semiconductor dies and methods of forming the same5 Aug 2025US 12,381,181 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Multi-chip package having stress relief structure20 May 2025US 12,308,344 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor devices and methods of manufacturing semiconductor devices6 May 2025US 12,293,950 B2Amkor Technology Japan, Inc.
- Assembly6 Aug 2026US 2026/0231816 A1General Electric Technology GmbH
- Multistage sealed power-electronic module23 Jul 2026US 2026/0215334 A1
- Semiconductor arrangement with at least one semiconductor element16 Jul 2026US 2026/0206639 A1Siemens Aktiengesellschaft
- Semiconductor assembly comprising at least one semiconductor element16 Jul 2026US 2026/0206660 A1Siemens Aktiengesellschaft
- Semiconductor package25 Jun 2026US 2026/0182442 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Methods of manufacturing a printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer190US 9,530,709 B2Qorvo US, Inc. · 2016
- Bonded structures150US 10,522,499 B2Invensas Bonding Technologies, Inc. · 2019
- Method for reducing conductive and convective heat loss from the battery in an RFID tag or other battery-powered devices134US 5,323,150 AMicron Technology, Inc. · 1994
- Microelectronic device package with conductive elements and associated method of manufacture93US 6,614,092 B2Micron Technology, Inc. · 2003
- Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture54US 6,670,719 B2Micron Technology, Inc. · 2003