Bonded structures
AssigneeInvensas Bonding Technologies, Inc.
InventorsPaul M. Enquist, Liang Wang, Rajesh Katkar, Javier A. DeLaCruz, Arkalgud R. Sitaram
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Abstract
A bonded structure can include a first element having a first interface feature and a second element having a second interface feature. The first interface feature can be bonded to the second interface feature to define an interface structure. A conductive trace can be disposed in or on the second element. A bond pad can be provided at an upper surface of the first element and in electrical communication with the conductive trace. An integrated device can be coupled to or formed with the first element or the second element.
Claims28
A bonded structure comprising:
- a first element having a first interface feature comprising a first conductive feature and a first non-conductive feature;
- a second element having a second interface feature comprising a second conductive feature and a second non-conductive feature, the first conductive feature of the first interface feature directly bonded to the second conductive feature of the second interface feature without an intervening adhesive, and the first non-conductive feature of the first interface feature directly bonded to the second non-conductive feature of the second interface feature without an intervening adhesive, to define an interface structure;
- a conductive trace disposed in or on the second element;
- a bond pad at an upper surface of the first element and in electrical communication with the conductive trace;
- and
- an integrated device coupled to or formed with the first element or the second element,
- wherein a bonded interface between the first conductive feature and the second conductive feature substantially surrounds an interior region of the bonded structure.
A bonded structure comprising:
- a first element having a first interface feature comprising a first conductive feature and a first non-conductive feature;
- a second element having a second interface feature comprising a second conductive feature and a second non-conductive feature, the first conductive feature of the first interface feature directly bonded to the second conductive feature of the second interface feature without an intervening adhesive, and the first non-conductive feature of the first interface feature directly bonded to the second non-conductive feature of the second interface feature without an intervening adhesive, to define an interface structure;
- a bond pad at an upper surface of the first element;
- an integrated device coupled to or formed with the first element or the second element;
- and
- an electrical interconnect extending from the bond pad through the first element to electrically connect to the integrated device,
- wherein a bonded interface between the first conductive feature and the second conductive feature substantially surrounds an interior region of the bonded structure.
A method of forming a bonded structure, the method comprising:
- providing a first element having a first interface feature comprising a first conductive feature and a first non-conductive feature and a second element having a second interface feature comprising a second conductive feature and a second non-conductive feature, a conductive trace being disposed in or on the second element;
- directly bonding the first conductive feature of the first interface feature and the second conductive feature of the second interface feature without an intervening adhesive;
- and
- directly bonding the first non-conductive feature of the first interface feature and the second non-conductive feature of the second interface feature without an intervening adhesive,
- wherein a bond pad is disposed at an upper surface of the first element and in electrical communication with the conductive trace, wherein an integrated device is coupled to or formed with the first element or the second element, and wherein a bonded interface between the first conductive feature and the second conductive feature substantially surrounds an interior region of the bonded structure.
Dependencies are inferred from the claim text.