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US 12,593,725 B2Granted
Electronic device
AssigneeInnolux Corporation
InventorsChia-Chi Ho, Jen-Hai Chi, Chin-Lung Ting
Life of this patent
Estimating the term…
Abstract
Provided is an electronic device including a substrate, a first metal layer, an electronic component, a cover layer, and an adhesive layer. The first metal layer is formed on the substrate. The electronic component is disposed on the substrate and electrically connected to the first metal layer. The adhesive layer is adhered to the substrate and the cover layer.
Claims19
An electronic device, comprising:
- a substrate;
- a first metal layer, formed on the substrate, wherein the first metal layer occupies 80% to 90% of an area of the substrate;
- an electronic component, disposed on the substrate and electrically connected to the first metal layer;
- a cover layer;
- and
- an adhesive layer, adhered to the substrate and the cover layer.
3 more elements
An electronic device, comprising:
- a substrate;
- a first metal layer, formed on the substrate, wherein the first metal layer has a plurality of openings, the openings are closed patterns surrounded by a material of the first metal layer;
- an electronic component, disposed on the substrate and electrically connected to the first metal layer, and the electronic component overlapping one of the openings;
- a cover layer;
- and
- an adhesive layer, adhered to the substrate and the cover layer.
3 more elements
Dependencies are inferred from the claim text.