H10W 76/45
Liquid fillings
H10W76/45 (Liquid fillings) appears on 66 US grants and 58 published applications in this corpus.
Search patents in H10W- Granted patents
- 66
- Published applications
- 58
- Assignees
- 48
- Inventors
- 140
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 5 | 1 |
| 2002 | 1 | 0 |
| 2003 | 1 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 1 | 1 |
| 2008 | 1 | 3 |
| 2009 | 1 | 0 |
| 2010 | 1 | 2 |
| 2011 | 1 | 1 |
| 2012 | 0 | 2 |
| 2013 | 2 | 1 |
| 2014 | 1 | 2 |
| 2015 | 2 | 2 |
| 2016 | 3 | 4 |
| 2017 | 0 | 0 |
| 2018 | 1 | 3 |
| 2019 | 4 | 4 |
| 2020 | 5 | 10 |
| 2021 | 3 | 3 |
| 2022 | 6 | 3 |
| 2023 | 4 | 6 |
| 2024 | 0 | 4 |
| 2025 | 2 | 1 |
| 2026 | 4 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Dam surrounding a die on a substrate22 Sep 2026US 12,745,668 B2Intel Corporation
- Semiconductor module with meltable encapsulant zones11 Aug 2026US 12,708,028 B2Infineon Technologies AG
- Direct cooling type power module24 Mar 2026US 12,588,504 B2Hyundai Motor Company
- Power semiconductor module arrangement and method for producing the same24 Feb 2026US 12,564,094 B2Infineon Technologies AG
- Cooling of conformal power delivery structures2 Dec 2025US 12,489,032 B2Intel Corporation
- Semiconductor arrangement with at least one semiconductor element16 Jul 2026US 2026/0206639 A1Siemens Aktiengesellschaft
- Semiconductor assembly comprising at least one semiconductor element16 Jul 2026US 2026/0206660 A1Siemens Aktiengesellschaft
- Electronic package structure manufacturing method thereof28 May 2026US 2026/0150682 A1Acer Incorporated
- Power semiconductor module arrangement and method for producing the same20 Feb 2025US 2025/0062170 A1Infineon Technologies AG
- Semiconductor module with meltable encapsulant zones5 Dec 2024US 2024/0404903 A1Infineon Technologies AG
Most cited
By later US patents
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- Microelectronic mounting with multiple lead deformation and bonding201US 5,801,441 ATessera, Inc. · 1998
- Fan-out semiconductor chip assembly189US 5,688,716 ATessera, Inc. · 1997
- Microelectronic assembly fabrication with terminal formation from a conductive layer173US 5,989,936 ATessera, Inc. · 1999
- Microelectronic assemblies with multiple leads152US 6,194,291 B1Tessera, Inc. · 2001