Semiconductor module with meltable encapsulant zones
AssigneeInfineon Technologies AG
InventorsAnita Herzer, Markus Wiesemann
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Abstract
A semiconductor module includes a power electronics carrier including a metallization layer disposed on an electrically insulating substrate, a power semiconductor die mounted on the power electronics carrier, a housing that surrounds an interior volume over the power electronics carrier, an electrically insulating encapsulant within the interior volume that encapsulates the power semiconductor die, wherein the electrically insulating encapsulant is configured to transform during operation of the power semiconductor die such that a liquified envelope of the electrically insulating encapsulant surrounds the power semiconductor die and such that a solid outer region of the electrically insulating encapsulant surrounds the liquified envelope.
Claims18
A semiconductor module, comprising:
- a power electronics carrier comprising a metallization layer disposed on an electrically insulating substrate;
- a power semiconductor die mounted on the power electronics carrier;
- a housing that surrounds an interior volume over the power electronics carrier;
- and
- an electrically insulating encapsulant within the interior volume that encapsulates the power semiconductor die,
- wherein the electrically insulating encapsulant is a solid at room temperature, and
- wherein the electrically insulating encapsulant is configured to liquify without curing in response to heat generated by the power semiconductor die during operation.
A semiconductor module, comprising:
- a power electronics carrier comprising a metallization layer disposed on an electrically insulating substrate;
- a power semiconductor die mounted on the power electronics carrier;
- a housing that surrounds an interior volume over the power electronics carrier;
- and
- an electrically insulating encapsulant within the interior volume that encapsulates the power semiconductor die,
- wherein the electrically insulating encapsulant is configured to transform during operation of the power semiconductor die such that a liquified envelope of the electrically insulating encapsulant surrounds the power semiconductor die and such that a solid outer region of the electrically insulating encapsulant surrounds the liquified envelope.
Dependencies are inferred from the claim text.