Power semiconductor module arrangement and method for producing the same
AssigneeInfineon Technologies AG
InventorsMarkus Wiesemann, Anita Herzer
Life of this patent
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Abstract
A power semiconductor module arrangement includes: a substrate arranged in or forming a ground surface of a housing having sidewalls; at least one semiconductor body arranged on the substrate; a first layer partly filling the housing and completely covering the substrate and the at least one semiconductor body arranged thereon; and a second layer arranged adjacent to the first layer. The first layer is a liquid or gel-like layer. The second layer is a solid or gel-like layer. The first layer is arranged between the substrate and the second layer. The second layer is arranged distant from a top of the housing.
Claims15
A power semiconductor module arrangement, comprising:
- a substrate arranged in or forming a ground surface of a housing, the housing comprising sidewalls;
- at least one semiconductor body arranged on the substrate;
- a first layer partly filling the housing and completely covering the substrate and the at least one semiconductor body arranged thereon;
- and
- a second layer arranged adjacent to the first layer,
- wherein the first layer is a liquid or gel-like layer,
- wherein the second layer is a solid or gel-like layer,
- wherein the first layer is arranged between the substrate and the second layer, and
- wherein the second layer is arranged distant from a top of the housing.
A method, comprising:
- filling a first material having a first density in a housing, wherein the housing comprises sidewalls, and a substrate with at least one semiconductor body arranged thereon is arranged in or forms a ground surface of the housing;
- filling a second material having a second density in the housing, the first density being higher than the second density, to form a liquid first layer consisting of the first material and a liquid or gel-like pre-layer consisting of the second material;
- and
- performing a curing step,
- wherein the curing step cures the second material and forms a solid or gel like second layer,
- wherein the first layer remains liquid during and after the curing step,
- wherein the first layer partly fills the housing and completely covers the substrate and the at least one semiconductor body arranged thereon,
- wherein the first layer forms between the substrate and the second layer, and
- wherein the second layer is arranged distant from a top of the housing.
Dependencies are inferred from the claim text.