Microelectronic assemblies with multiple leads
AssigneeTessera, Inc.
InventorsThomas H. DiStefano, John W. Smith
Life of this patent
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Abstract
A microelectronic connection component includes a support such as a dielectric sheet having elongated leads extending along a surface. The leads have terminal ends permanently connected to the support and tip ends releasably connected to the support. The support is juxtaposed with a further element such as a semiconductor chip or wafer, and tip ends of the leads are bonded to contacts on the wafer using a bonding tool advanced through holes in the support. After bonding, the support and the further element are moved away from one another so as to deform the leads.
Claims14
A method of making a microelectronic assembly comprising:
- (a) juxtaposing a first element having a plurality of leads extending along a surface with a second element so that contacts on said second element are aligned with tip ends of the leads, said leads having terminal ends attached to the first element;
- (b) bonding the tip ends of the leads to the contacts on the second element by advancing a bonding tool through holes in a support to engage the tip ends of the leads with the contacts;
- (c) after said bonding step, moving the first and second elements through a preselected displacement so as to bend said tip ends away from said first element.
Dependencies are inferred from the claim text.