Electronic package structure manufacturing method thereof

Abstract

Disclosed is an electronic package structure including a substrate, a first electronic element, at least one second electronic element, a wall, an electrically insulating glue, a liquid metal, and a heat dissipating member. The first electronic element and the second electronic element are disposed on the substrate respectively and adjoin each other. The wall disposed on the substrate surrounds the first and the second electronic elements. The electrically insulating glue is disposed on the substrate and filled between the first electronic elements and the wall to cover and seal the second electronic element. The liquid metal is disposed on the first electronic element. The heat dissipating member is disposed on the first electronic element and squeezes the liquid metal. Heat generated by the first electronic element is transferred to the heat dissipating member through the liquid metal. A manufacturing method of the electronic package structure is also provided.

Dependencies are inferred from the claim text.