Cooling of conformal power delivery structures
AssigneeIntel Corporation
InventorsFeras Eid, Aleksandar Aleksov, Henning Braunisch, Adel Elsherbini, Thomas L. Sounart, Johanna Swan
Life of this patent
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Abstract
Technologies for cooling conformal power delivery structures are disclosed. In one embodiment, an integrated circuit component has a die with a backside power plane mated to it. A lid of the integrated circuit component is mated with the backside power plane, forming a sealed cavity. The lid has an inlet and an outlet, and a channel is defined in the lid for liquid coolant to flow from the inlet, across the backside power plane, and to the outlet. The liquid coolant directly contacts the backside power plane, efficiently removing heat from the backside power plane.
Claims9
An integrated circuit component comprising:
- a die;
- a backside power plane mated with the die;
- and
- a lid mated with the backside power plane to create a seal between the lid and the backside power plane,
- wherein the lid comprises an inlet and an outlet, wherein a channel is defined between the inlet and the outlet for liquid coolant to flow from the inlet, over the backside power plane, and to the outlet,
- wherein the backside power plane is a conformal power delivery structure,
- wherein the conformal power delivery structure comprises:
- a first electrically conductive layer comprising metal, the first electrically conductive layer defining one or more recesses;
- a second electrically conductive layer comprising metal, the second electrically conductive layer at least partially within the one or more recesses of the first electrically conductive layer and having a lower surface that generally conforms with an upper surface of the first electrically conductive layer;
- and
- a dielectric material between the surfaces of the first electrically conductive layer and the second electrically conductive layer that conform with one another.
A system comprising:
- an integrated circuit component comprising a backside power plane;
- and
- means for liquid cooling the backside power plane,
- wherein the backside power plane is a conformal power delivery structure,
- wherein the conformal power delivery structure comprises:
- a first electrically conductive layer comprising metal, the first electrically conductive layer defining one or more recesses;
- a second electrically conductive layer comprising metal, the second electrically conductive layer at least partially within the one or more recesses of the first electrically conductive layer and having a lower surface that generally conforms with an upper surface of the first electrically conductive layer;
- and
- a dielectric material between the surfaces of the first electrically conductive layer and the second electrically conductive layer that conform with one another.
Dependencies are inferred from the claim text.