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US 12,588,504 B2Granted
Direct cooling type power module
AssigneesHyundai Motor Company, Kia Corporation
InventorsSuk Hyun Lim, Tae Hwa Kim
Life of this patent
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Abstract
A direct cooling type power module comprising, an enclosure filled with an insulating fluid, a power semiconductor device disposed inside the enclosure and a bonding unit comprising a porous layer, and a thermally conductive layer to which the power semiconductor device is bonded, and allowing the power semiconductor device to exchange heat with the insulating fluid by the porous layer and the thermally conductive layer.
Claims9
A direct cooling type power module comprising:
- an enclosure filled with an insulating fluid;
- a power semiconductor device disposed inside the enclosure;
- and
- a bonding unit comprising a porous layer, and a thermally conductive layer to which the power semiconductor device is bonded, and allowing the power semiconductor device to exchange heat with the insulating fluid by the porous layer and the thermally conductive layer,
- wherein the enclosure is internally provided with a supporter connected to the thermally conductive layer of the bonding unit and disposing the power semiconductor device and the bonding unit at an inner center thereof,
- the supporter being provided to protrude inwardly from the enclosure, wherein the bonding unit comprises a plurality of bonding units disposed to be spaced from each other in the enclosure and a conductive wire electrically connects the plurality of bonding units.
3 more elements
Dependencies are inferred from the claim text.