System-in-package (sip) configured to receive multiple memory dies

A package comprising:

• a substrate comprising:
• a first set of contacts;
• multiple second sets of contacts;
• and
• one or more conductors that electrically couple the first set of contacts to the multiple second sets of contacts;
• one or more dies electrically coupled to the first set of contacts, wherein the one or more dies comprise one or more processors;
• and
• multiple memory dies electrically coupled to the multiple second sets of contacts,
• wherein an underfill material is disposed between the one or more dies and the substrate and not between the multiple memory dies and the substrate.

A method of fabrication, the method comprising:

• providing a substrate that defines multiple empty memory attach regions, the substrate including:
• a first set of contacts;
• multiple second sets of contacts within the multiple empty memory attach regions, wherein at least a portion of each of the multiple second sets of contacts is exposed along an upper surface of the substrate, and wherein the multiple second sets of contacts are configured to be electrically coupled to multiple memory dies;
• and
• one or more conductors that electrically couple the first set of contacts to the multiple second sets of contacts;
• electrically coupling one or more dies to the first set of contacts, wherein the one or more dies comprise one or more processors;
• and
• depositing an underfill material between the one or more dies and the substrate.