Integrated circuit packages, devices using the same, and methods of forming the same

A device comprising:

• a package substrate;
• a package component attached to the package substrate, the package component comprising a logic device and memory devices;
• a first elastic dam on the package component, the first elastic dam overlapping the memory devices;
• a stiffener ring on the first elastic dam, the stiffener ring overlapping the memory devices;
• and
• an opening extending through the stiffener ring and the first elastic dam, the opening disposed above the logic device in a top-down view.

A device comprising:

• a package component comprising a logic device and a memory device;
• a package stiffener over the package component;
• a first elastic dam between the package stiffener and the package component, the first elastic dam overlapping the memory device, the first elastic dam comprising an adhesive material;
• a heat spreader, a protruding portion of the heat spreader extending through the package stiffener and the first elastic dam to be thermally coupled to the logic device;
• and
• a thermal interface material between the protruding portion of the heat spreader and the logic device, the first elastic dam laterally surrounding the thermal interface material, the thermal interface material and the adhesive material of the first elastic dam being different material compositions.