H10W 76/60
Seals
H10W76/60 (Seals) appears on 2,680 US grants and 2,798 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,680
- Published applications
- 2,798
- Assignees
- 807
- Inventors
- 5,445
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 2 | 0 |
| 1978 | 4 | 0 |
| 1979 | 5 | 0 |
| 1980 | 5 | 0 |
| 1981 | 6 | 0 |
| 1982 | 7 | 0 |
| 1983 | 6 | 0 |
| 1984 | 6 | 0 |
| 1985 | 12 | 0 |
| 1986 | 10 | 0 |
| 1987 | 15 | 0 |
| 1988 | 11 | 0 |
| 1989 | 17 | 0 |
| 1990 | 14 | 0 |
| 1991 | 26 | 0 |
| 1992 | 24 | 0 |
| 1993 | 13 | 0 |
| 1994 | 33 | 0 |
| 1995 | 31 | 0 |
| 1996 | 22 | 0 |
| 1997 | 25 | 0 |
| 1998 | 41 | 0 |
| 1999 | 40 | 0 |
| 2000 | 34 | 0 |
| 2001 | 38 | 14 |
| 2002 | 58 | 70 |
| 2003 | 53 | 64 |
| 2004 | 62 | 84 |
| 2005 | 76 | 102 |
| 2006 | 46 | 85 |
| 2007 | 63 | 88 |
| 2008 | 47 | 75 |
| 2009 | 61 | 69 |
| 2010 | 74 | 92 |
| 2011 | 80 | 82 |
| 2012 | 70 | 89 |
| 2013 | 87 | 91 |
| 2014 | 103 | 109 |
| 2015 | 113 | 139 |
| 2016 | 117 | 111 |
| 2017 | 128 | 125 |
| 2018 | 123 | 146 |
| 2019 | 131 | 148 |
| 2020 | 136 | 138 |
| 2021 | 98 | 133 |
| 2022 | 102 | 157 |
| 2023 | 104 | 174 |
| 2024 | 110 | 157 |
| 2025 | 116 | 158 |
| 2026 | 70 | 98 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor package and method of manufacturing the same6 Oct 2026US 12,757,796 B2Samsung Electronics Co., Ltd.
- Package structure with protective lid6 Oct 2026US 12,757,797 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Anchor-containing underfill structures for a chip package and methods of forming the same29 Sep 2026US 12,751,304 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic devices and methods of manufacturing electronic devices29 Sep 2026US 12,751,321 B2Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor device and method for sensing external condition in harsh environment15 Sep 2026US 12,736,425 B2UTAC Headquarters Pte. Ltd.
- Semiconductor device8 Oct 2026US 2026/0314398 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit packages, devices using the same, and methods of forming the same8 Oct 2026US 2026/0314483 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314484 A1Amkor Technology Singapore Holding Pte.Ltd.
- Electromagnetic compartmental shielding for multichip cavity system-in-package (sip) module17 Sep 2026US 2026/0282931 A1Qorvo US, Inc.
- Semiconductor device17 Sep 2026US 2026/0282978 A1Mitsubishi Electric Corporation
Most cited
By later US patents
- Hermetically sealed printed circuit boards511US 10,588,231 B2Covidien LP · 2020
- Integrated circuit package having adhesive bead supporting planar lid above planar substrate332US 6,268,654 B1Ankor Technology, Inc. · 2001
- Method of making a cavity ball grid array apparatus317US 6,326,244 B1Micron Technology, Inc. · 2001
- Semiconductor device including eutectic bonding portion and method for manufacturing the same314US 6,555,901 B1Denso Corporation · 2003
- Method of fabrication of a microstructure having an internal cavity302US 6,297,072 B1Interuniversitair Micro-Elktronica Centrum (IMEC VZW) · 2001