Semiconductor device and method for sensing external condition in harsh environment

A semiconductor device, comprising:

• a first electrical component including a sensing region;
• an adhesive layer disposed on the first electrical component around a perimeter of the sensing region;
• a cover lid disposed over the first electrical component with an opening in the cover lid aligned over the sensing region, wherein the adhesive layer extends from the first electrical component to the cover lid;
• and
• a gel material disposed within the opening of the cover lid and on the sensing region within a boundary defined by the adhesive layer to environmentally seal the sensing region.

A method of making a semiconductor device, comprising:

• providing a first electrical component including a sensing region;
• disposing an adhesive layer on the first electrical component around a perimeter of the sensing region;
• disposing a cover lid over the first electrical component with an opening in the cover lid aligned over the sensing region, wherein the adhesive layer extends from the first electrical component to the cover lid;
• and
• disposing a gel material within the opening of the cover lid and on the sensing region within a boundary defined by the adhesive layer to environmentally seal the sensing region.