H10W 76/67
Characterised by their materials
Official title: characterised by their materials
H10W76/67 (Characterised by their materials) appears on 175 US grants and 218 published applications in this corpus.
Search patents in H10W- Granted patents
- 175
- Published applications
- 218
- Assignees
- 85
- Inventors
- 394
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 1 |
| 2005 | 1 | 1 |
| 2006 | 0 | 1 |
| 2007 | 1 | 3 |
| 2008 | 1 | 0 |
| 2009 | 0 | 1 |
| 2010 | 3 | 4 |
| 2011 | 2 | 3 |
| 2012 | 1 | 7 |
| 2013 | 5 | 6 |
| 2014 | 5 | 8 |
| 2015 | 10 | 28 |
| 2016 | 24 | 21 |
| 2017 | 26 | 27 |
| 2018 | 21 | 21 |
| 2019 | 10 | 8 |
| 2020 | 19 | 12 |
| 2021 | 7 | 10 |
| 2022 | 4 | 11 |
| 2023 | 5 | 14 |
| 2024 | 9 | 16 |
| 2025 | 8 | 7 |
| 2026 | 11 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic devices and methods of manufacturing electronic devices29 Sep 2026US 12,751,321 B2Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor device and method for sensing external condition in harsh environment15 Sep 2026US 12,736,425 B2UTAC Headquarters Pte. Ltd.
- Semiconductor device11 Aug 2026US 12,707,966 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package14 Jul 2026US 12,685,154 B2Samsung Electronics Co., Ltd.
- Semiconductor device and method of manufacturing semiconductor device23 Jun 2026US 12,666,999 B2Mitsubishi Electric Corporation
- Semiconductor device8 Oct 2026US 2026/0314398 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314484 A1Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor device17 Sep 2026US 2026/0282978 A1Mitsubishi Electric Corporation
- Easily dismantlable thermosetting resin composition and dismantling method27 Aug 2026US 2026/0250508 A1Sumitomo Bakelite Co., Ltd.
- Semiconductor device20 Aug 2026US 2026/0248030 A1Kabushiki Kaisha Toshiba
Most cited
By later US patents
- Leadless chip carrier apparatus providing for a transmission line environment and improved heat dissipation166US 4,551,747 AMayo Foundation · 1985
- Integrated circuit assemblies with reinforcement frames, and methods of manufacture50US 9,355,997 B2Invensas Corporation · 2016
- Stacked semiconductor die assemblies with partitioned logic and associated systems and methods42US 10,978,427 B2Micron Technology, Inc. · 2021
- Semiconductor device and manufacturing method thereof22US 9,048,125 B2Amkor Technology, Inc. · 2015
- Tamper-proof electronic packages with stressed glass component substrate(s)15US 9,881,880 B2International Business Machines Corporation · 2018