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US 12,707,966 B2Granted
Semiconductor device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Chien Pan, Pu Wang, Li-Hui Cheng, Ying-Ching Shih
Life of this patent
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Abstract
A semiconductor device includes a package substrate, a package component and at least one adhesive pattern. The package component has a thermal interface material (TIM) layer thereon. The adhesive pattern has a first surface facing the package substrate and a second surface opposite to the first surface, and the second surface of the at least one adhesive pattern is substantially coplanar with a surface of the TIM layer.
Claims20
A semiconductor device, comprising:
- a package substrate;
- a package component, bonded to the package substrate;
- a lid, comprising a first portion adhered to the package substrate through an adhesive layer and a second portion connecting to the first portion and covering the package component;
- and
- a plurality of first adhesive patterns, wherein the first adhesive patterns are adhered to and disposed between the package substrate and the second portion of the lid, the first adhesive patterns are disposed at a first side of the package component, and at least two of the first adhesive patterns are physically separated from each other and substantially aligned with each other in a first direction along which the first side is extended.
2 more elements
A semiconductor device, comprising:
- a package substrate;
- a package component having a thermal interface material (TIM) layer thereon, and having a first side and a second side physically connecting to the first side;
- a lid, adhered to the package substrate through an adhesive layer;
- a plurality of first adhesive patterns, disposed at the first side of the package component, and disposed between the adhesive layer and the package component, wherein a distance between one of the first adhesive patterns and the first side of the package component is substantially equal to a distance between another of the first adhesive patterns and the first side of the package component;
- and
- at least one second adhesive pattern, disposed at the second side of the package component, and disposed between the adhesive layer and the package component.
3 more elements
A semiconductor device, comprising:
- a package substrate;
- a package component, bonded to the package substrate;
- a lid, adhered to the package substrate through an adhesive layer;
- and
- a plurality of first adhesive patterns, wherein the first adhesive patterns are arranged along a first side of the package component, and at least two of the first adhesive patterns are physically separated from each other and substantially aligned with each other in a first direction along which the first side is extended.
2 more elements
Dependencies are inferred from the claim text.