Electronic devices and methods of manufacturing electronic devices

Abstract

In one example, an electronic device can include a substrate, a module comprising an electronic component and coupled to the substrate, and a first passive device coupled to the substrate and disposed adjacent a first side of the module. An underfill can cover the first passive device, and it can be disposed between the first passive device and the substrate. The first passive device can be within 100 μm of the module. The first passive device can be within 50 μm of a fillet of the underfill. A second passive device can be coupled to the substrate and disposed adjacent a second side of the module opposite the first side of the module. The second passive device can be covered by the underfill. The first side of the module comprises a molded sidewall oriented towards the first passive device. Other examples and related methods are also disclosed herein.

Dependencies are inferred from the claim text.