Semiconductor device and method of manufacturing semiconductor device

Abstract

A semiconductor device includes: a heat radiation plate; an insulating substrate disposed on an upper surface of the heat radiation plate; a semiconductor element mounted to an upper surface of the insulating substrate; a frame-like resin case disposed in a peripheral edge portion of the upper surface of the heat radiation plate and extending in an up-down direction to surround a lateral surface of each of the insulating substrate and the semiconductor element; and a resin bonded member formed to be detachable from the resin case as a separate body separated from the resin case and bonded to the heat radiation plate while being attached to the resin case. Formed in the bonded member is a screw hole to which a screw is screwed to bond the bonded member to the heat radiation plate.

Dependencies are inferred from the claim text.