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US 2026/0250508 A1Published application
Easily dismantlable thermosetting resin composition and dismantling method
AssigneeSumitomo Bakelite Co., Ltd.
InventorsKoji MAKIHARA, Tsuneaki KUMAMOTO, Masayoshi HASHIZUME
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Abstract
An easily dismantlable thermosetting resin composition according to the present invention contains a thermosetting component; and a cured product which is obtained by thermally curing this thermosetting resin composition has a structure represented by Formula (1).
Claims18
An easily dismantlable thermosetting resin composition comprising:
- a thermosetting component,
- wherein a cured product which is obtained by thermally curing the easily dismantlable thermosetting resin composition has a structure represented by Formula (1),
- (In Formula (1), R1 and R2 each independently represent any of a hydrogen atom, a hydrocarbon group or aromatic group having 1 to 30 carbon atoms, a hydroxyl group, and an alkoxyl group having 1 to 30 carbon atoms)
Dependencies are inferred from the claim text.