Tamper-proof electronic packages with stressed glass component substrate(s)

A tamper-proof electronic package comprising:

• a glass substrate, the glass substrate comprising stressed glass with a compressively-stressed surface layer;
• at least one electronic component secured to the glass substrate within a secure volume of the tamper-proof electronic package;
• a glass enclosure defining, at least in part, the secure volume, the glass enclosure comprising stressed glass with a compressively-stressed surface layer, and wherein the glass enclosure is the glass substrate, and the at least one electronic component is adhesively coupled to an inner surface of the glass enclosure;
• wherein the glass substrate fragments with an attempted intrusion event into the tamper-proof electronic package, the fragmenting of the glass substrate also fragmenting the at least one electronic component secured thereto, destroying the at least one electronic component;
• and
• wherein the glass enclosure is an upper glass enclosure, and the tamper-proof electronic package further comprises a base glass enclosure, the upper glass enclosure and the base glass enclosure being adhesively secured together to define the secure volume, and wherein the base glass enclosure also comprises stressed glass with a compressively-stressed surface layer.

A fabrication method comprising:

• fabricating a tamper-proof electronic package, the fabricating comprising:
• providing a glass substrate, the glass substrate comprising stressed glass with a compressively-stressed surface layer;
• securing at least one electronic component to the glass substrate, and the glass substrate being within a secure volume of the tamper-proof electronic package;
• providing a multilayer circuit board and coupling the glass substrate to the multilayer circuit board;
• providing an embedded tamper-respondent sensor disposed within the multilayer circuit board;
• and
• wherein the glass substrate fragments with an attempted intrusion event into the secure volume of the tamper-proof electronic package, the fragmenting of the glass substrate also fragmenting the at least one electronic component secured thereto, destroying the at least one electronic component, the glass substrate and the embedded tamper-respondent sensor within the multilayer circuit board together facilitating defining the secure volume of the tamper-proof electronic package.