Package structure with protective lid

A chip package, comprising:

• a plurality of chip structures over a redistribution structure;
• a protective layer laterally surrounding the chip structures;
• a first adhesive element directly above the protection layer, wherein the first adhesive element has a first thermal conductivity;
• a second adhesive element having a first portion and a second portion, wherein the first portion is directly above a first chip structure of the chip structures, the second portion is directly above a second chip structure of the chip structures, the first portion is spaced apart from the second portion, wherein the second adhesive element has a second thermal conductivity, and the second thermal conductivity is different than the first thermal conductivity;
• and
• a protective lid over the first adhesive element and the second adhesive element.

A package structure, comprising:

• a chip structure;
• a first adhesive element directly above the chip structure, wherein the first adhesive element has a first portion and a second portion, the first portion is spaced apart from the second portion, and the first adhesive element has a first thermal conductivity;
• and
• a second adhesive element directly above the chip structure, wherein the second adhesive element has a second thermal conductivity, and the second thermal conductivity is higher than the first thermal conductivity.