H10W 76/63
Characterised by their shape or disposition
Official title: characterised by their shape or disposition, e.g. between cap and walls of a container
H10W76/63 (Characterised by their shape or disposition) appears on 238 US grants and 296 published applications in this corpus.
Search patents in H10W- Granted patents
- 238
- Published applications
- 296
- Assignees
- 137
- Inventors
- 718
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 5 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 6 | 1 |
| 2002 | 7 | 14 |
| 2003 | 8 | 11 |
| 2004 | 11 | 14 |
| 2005 | 8 | 17 |
| 2006 | 8 | 8 |
| 2007 | 11 | 7 |
| 2008 | 4 | 6 |
| 2009 | 5 | 5 |
| 2010 | 6 | 7 |
| 2011 | 5 | 4 |
| 2012 | 5 | 6 |
| 2013 | 3 | 3 |
| 2014 | 5 | 5 |
| 2015 | 5 | 7 |
| 2016 | 5 | 10 |
| 2017 | 13 | 12 |
| 2018 | 5 | 6 |
| 2019 | 10 | 8 |
| 2020 | 12 | 4 |
| 2021 | 1 | 12 |
| 2022 | 8 | 18 |
| 2023 | 10 | 38 |
| 2024 | 7 | 29 |
| 2025 | 25 | 24 |
| 2026 | 18 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Anchor-containing underfill structures for a chip package and methods of forming the same29 Sep 2026US 12,751,304 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic devices and methods of manufacturing electronic devices29 Sep 2026US 12,751,321 B2Amkor Technology Singapore Holding Pte.Ltd.
- Electronic package and manufacturing method thereof15 Sep 2026US 12,740,407 B2Siliconware Precision Industries Co., Ltd.
- Semiconductor device11 Aug 2026US 12,707,966 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package14 Jul 2026US 12,685,154 B2Samsung Electronics Co., Ltd.
- Semiconductor device8 Oct 2026US 2026/0314398 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electromagnetic compartmental shielding for multichip cavity system-in-package (sip) module17 Sep 2026US 2026/0282931 A1Qorvo US, Inc.
- Semiconductor device17 Sep 2026US 2026/0282978 A1Mitsubishi Electric Corporation
- Semiconductor device20 Aug 2026US 2026/0248030 A1Kabushiki Kaisha Toshiba
- Semiconductor device20 Aug 2026US 2026/0248032 A1Mitsubishi Electric Corporation
Most cited
By later US patents
- Leadless chip carrier apparatus providing for a transmission line environment and improved heat dissipation166US 4,551,747 AMayo Foundation · 1985
- Semiconductor device package having locating mechanism for properly positioning semiconductor device within package154US 5,311,402 ANEC Corporation · 1994
- Methods for wafer to wafer bonding using microstructures110US 6,406,636 B1MegaSense, Inc. · 2002
- Cover for an optical device and method for making same96US 6,428,650 B1Amerasia International Technology, Inc. · 2002
- Method for controlling thermal interface gap distance91US 6,294,408 B1International Business Machines Corporation · 2001