Semiconductor device

A semiconductor device comprising:

• a semiconductor element;
• a first electrode electrically connected to the semiconductor element;
• a second electrode provided to be adjacent to the first electrode and electrically connected to the semiconductor element;
• and
• a sealing material sealing the semiconductor element, an area other than an upper surface of the first electrode, and an area other than an upper surface of the second electrode, wherein
• the first electrode includes a first side surface protruding from an outer peripheral upper surface forming an outer peripheral portion of the sealing material and facing the second electrode and a first upper surface that is the upper surface exposed from the sealing material,
• the second electrode includes a second side surface protruding from the outer peripheral upper surface of the sealing material and facing the first electrode and a second upper surface that is the upper surface exposed from the sealing material,
• the first side surface and the second side surface are covered with the sealing material, and
• the sealing material includes at least either a recess portion or a protrusion portion between the first electrode and the second electrode.