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US 12,740,407 B2Granted
Electronic package and manufacturing method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsHsin-Jou Lin, Lung-Yuan Wang, Feng Kao, Chiu-Ling Chen
Life of this patent
Estimating the term…
Abstract
A method of manufacturing an electronic package is provided, in which a package module including a routing structure is stacked on a carrier structure via a plurality of conductive elements, a heat dissipation member covers a part of a surface of the routing structure, and an electronic module is disposed on another part of the surface of the routing structure, so that the routing structure is formed with at least one heat dissipation pad bonded to the heat dissipation member, such that the heat energy of the electronic module and the package module can be dissipated via the heat dissipation pad and the heat dissipation member.
Claims22
An electronic package, comprising:
- a carrier structure;
- a package module stacked on the carrier structure via a plurality of conductive elements and including a cladding layer, at least one electronic element and a plurality of conductive pillars embedded in the cladding layer, and a routing structure formed on the cladding layer, wherein the plurality of conductive elements and the routing structure are respectively disposed on opposite sides of the cladding layer, wherein the at least one electronic element and the plurality of conductive pillars are electrically connected to the carrier structure via the plurality of conductive elements, and the routing structure is electrically connected to the plurality of conductive pillars, and wherein the routing structure has at least one heat dissipation pad;
- a heat dissipation member having a ring body and a plurality of supporting legs extending downward from the ring body, wherein the ring body of the heat dissipation member is disposed on the at least one heat dissipation pad, the plurality of supporting legs of the heat dissipation member are bonded to the carrier structure, the ring body of the heat dissipation member only covers a part of a surface of the routing structure, and another part of the surface of the routing structure is exposed from the ring body;
- and
- at least one electronic module disposed on the another part of the surface of the routing structure exposed from an opening of the ring body of the heat dissipation member and electrically connected to the routing structure,
- wherein the plurality of conductive elements, the cladding layer, the at least one electronic element, and the routing structure having the at least one heat dissipation pad are positioned below the opening of the ring body of the heat dissipation member, the at least one electronic module is positioned above the opening of the ring body of the heat dissipation member and the routing structure having the at least one heat dissipation pad, the opening of the ring body of the heat dissipation member is positioned between the routing structure having the at least one heat dissipation pad and the at least one electronic module, and the plurality of conductive elements, the cladding layer, the at least one heat dissipation pad of the routing structure, the ring body of the heat dissipation member, and the at least one electronic module are sequentially positioned above the carrier structure.
3 more elements
A method of manufacturing an electronic package, comprising:
- providing a package module including a cladding layer, at least one electronic element and a plurality of conductive pillars embedded in the cladding layer, and a routing structure formed on the cladding layer, wherein the routing structure is electrically connected to the plurality of conductive pillars, and wherein the routing structure has at least one heat dissipation pad;
- stacking the package module on a carrier structure via a plurality of conductive elements, wherein the plurality of conductive elements and the routing structure are respectively located on opposite sides of the cladding layer, and wherein the at least one electronic element and the plurality of conductive pillars are electrically connected to the carrier structure via the plurality of conductive elements;
- disposing a ring body of a heat dissipation member on the at least one heat dissipation pad, and bonding a plurality of supporting legs of the heat dissipation member extended downward from the ring body to the carrier structure, wherein the ring body of the heat dissipation member only covers a part of a surface of the routing structure, and another part of the surface of the routing structure is exposed from the ring body;
- and
- disposing at least one electronic module on the another part of the surface of the routing structure exposed from an opening of the ring body of the heat dissipation member,
- wherein the at least one electronic module is electrically connected to the routing structure, the plurality of conductive elements, the cladding layer, the at least one electronic element, and the routing structure having the at least one heat dissipation pad are positioned below the opening of the ring body of the heat dissipation member, the at least one electronic module is positioned above the opening of the ring body of the heat dissipation member and the routing structure having the at least one heat dissipation pad, the opening of the ring body of the heat dissipation member is positioned between the routing structure having the at least one heat dissipation pad and the at least one electronic module, and the plurality of conductive elements, the cladding layer, the at least one heat dissipation pad of the routing structure, the ring body of the heat dissipation member, and the at least one electronic module are sequentially positioned above the carrier structure.
3 more elements
Dependencies are inferred from the claim text.