H10W 76/01
Manufacture or treatment
H10W76/01 (Manufacture or treatment) appears on 418 US grants and 517 published applications in this corpus.
Search patents in H10W- Granted patents
- 418
- Published applications
- 517
- Assignees
- 175
- Inventors
- 1,007
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 1 |
| 2002 | 3 | 1 |
| 2003 | 1 | 4 |
| 2004 | 1 | 3 |
| 2005 | 6 | 8 |
| 2006 | 2 | 0 |
| 2007 | 3 | 6 |
| 2008 | 2 | 1 |
| 2009 | 3 | 6 |
| 2010 | 4 | 3 |
| 2011 | 1 | 5 |
| 2012 | 3 | 4 |
| 2013 | 5 | 7 |
| 2014 | 5 | 10 |
| 2015 | 8 | 30 |
| 2016 | 21 | 50 |
| 2017 | 44 | 58 |
| 2018 | 60 | 53 |
| 2019 | 45 | 35 |
| 2020 | 34 | 25 |
| 2021 | 20 | 31 |
| 2022 | 33 | 45 |
| 2023 | 24 | 36 |
| 2024 | 30 | 38 |
| 2025 | 19 | 24 |
| 2026 | 19 | 33 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Package structure with protective lid6 Oct 2026US 12,757,797 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure including a package lid having a plurality of fins and methods of forming the same15 Sep 2026US 12,740,411 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of filling gaps between dies using silicon dioxide11 Aug 2026US 12,708,030 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Power semiconductor module arrangement and method for assembling the same11 Aug 2026US 12,708,033 B2Infineon Technologies AG
- Flanged stiffener ring4 Aug 2026US 12,702,056 B1Marvell Asia Pte Ltd
- System-in-package (sip) configured to receive multiple memory dies8 Oct 2026US 2026/0314443 A1QUALCOMM Incorporated
- Method of filling gaps between dies using silicon dioxide8 Oct 2026US 2026/0314481 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit package1 Oct 2026US 2026/0305337 A1STMicroelectronics International N. V.
- Electromagnetic compartmental shielding for multichip cavity system-in-package (sip) module17 Sep 2026US 2026/0282931 A1Qorvo US, Inc.
- Semiconductor package and a method for forming the same17 Sep 2026US 2026/0282932 A1JCET STATS ChipPAC Korea Limited
Most cited
By later US patents
- Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same291US 9,461,001 B1Advanced Semiconductor Engineering, Inc. · 2016
- Semiconductor device package and method of making such a package214US 5,173,766 ALSI Logic Corporation · 1992
- Method of forming interface between die and chip carrier129US 5,477,611 ATessera, Inc. · 1995
- Semiconductor chip device with solder diffusion protection101US 8,299,633 B2Advanced Micro Devices, Inc. · 2012
- Package-on-package stacked microelectronic structures54US 10,211,182 B2Intel IP Corporation · 2019