H10W 76/05
Providing fillings in containers
Official title: Providing fillings in containers, e.g. gas filling
H10W76/05 (Providing fillings in containers) appears on 155 US grants and 188 published applications in this corpus.
Search patents in H10W- Granted patents
- 155
- Published applications
- 188
- Assignees
- 91
- Inventors
- 396
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 1 |
| 2002 | 3 | 1 |
| 2003 | 1 | 4 |
| 2004 | 1 | 0 |
| 2005 | 3 | 3 |
| 2006 | 0 | 0 |
| 2007 | 2 | 2 |
| 2008 | 1 | 0 |
| 2009 | 2 | 2 |
| 2010 | 0 | 1 |
| 2011 | 0 | 4 |
| 2012 | 3 | 4 |
| 2013 | 5 | 4 |
| 2014 | 4 | 7 |
| 2015 | 4 | 8 |
| 2016 | 6 | 22 |
| 2017 | 24 | 30 |
| 2018 | 19 | 14 |
| 2019 | 12 | 9 |
| 2020 | 11 | 6 |
| 2021 | 8 | 18 |
| 2022 | 11 | 13 |
| 2023 | 9 | 10 |
| 2024 | 9 | 11 |
| 2025 | 3 | 7 |
| 2026 | 3 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of filling gaps between dies using silicon dioxide11 Aug 2026US 12,708,030 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor module and method for manufacturing semiconductor module14 Apr 2026US 12,604,760 B2Fuji Electric Co., Ltd.
- Power semiconductor module arrangement and method for producing the same24 Feb 2026US 12,564,094 B2Infineon Technologies AG
- Semiconductor component with damped bonding surfaces in a package with encapsulated pins14 Oct 2025US 12,444,671 B2Siemens Aktiengesellschaft
- Electronic package and manufacturing method thereof26 Aug 2025US 12,400,931 B2Siliconware Precision Industries Co., Ltd.
- Method of filling gaps between dies using silicon dioxide8 Oct 2026US 2026/0314481 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor assembly having a semiconductor element and a substrate10 Sep 2026US 2026/0271723 A1Siemens Aktiengesellschaft
- Epoxy resin composition, electronic component, semiconductor device, and semiconductor device manufacturing method6 Aug 2026US 2026/0231817 A1Namics Corporation
- Semiconductor module and manufacturing method for the same23 Jul 2026US 2026/0215333 A1Fuji Electric Co., Ltd.
- Semiconductor arrangement with at least one semiconductor element16 Jul 2026US 2026/0206639 A1Siemens Aktiengesellschaft
Most cited
By later US patents
- Semiconductor device package and method of making such a package214US 5,173,766 ALSI Logic Corporation · 1992
- Method of forming interface between die and chip carrier129US 5,477,611 ATessera, Inc. · 1995
- Semiconductor chip device with solder diffusion protection101US 8,299,633 B2Advanced Micro Devices, Inc. · 2012
- Package-on-package stacked microelectronic structures54US 10,211,182 B2Intel IP Corporation · 2019
- Method for injection molded flip chip encapsulation43US 5,981,312 AInternational Business Machines Corporation · 1999