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US 12,400,931 B2Granted
Electronic package and manufacturing method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsYu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin
Life of this patent
Estimating the term…
Abstract
An electronic package, in which a heat dissipation structure is disposed on a carrier structure to form a packaging space for electronic components to be accommodated in the packaging space, and the electronic components are completely encapsulated by a heat dissipation material to prevent the electronic components exposing from the heat dissipation material so as to improve the heat dissipation effect.
Claims20
An electronic package, comprising:
- a carrier structure;
- an electronic component disposed on the carrier structure;
- a heat dissipation structure including a heat dissipation body covering the electronic component and supporting legs vertically disposed on the heat dissipation body, wherein the heat dissipation structure is bonded onto the carrier structure via the supporting legs, such that a packaging space is formed between the heat dissipation body and the carrier structure, and the electronic component is disposed in the packaging space, wherein the supporting legs are formed with accommodation ports coated with a bonding material to engage with protruding portions of the carrier structure;
- and
- a heat dissipation material disposed in the packaging space and completely encapsulating the electronic component, wherein the electronic component is free from being exposed from the heat dissipation material.
2 more elements
A method for manufacturing an electronic package, comprising:
- providing a heat dissipation structure and a carrier structure with an electronic component, wherein the heat dissipation structure includes a heat dissipation body covering the electronic component and supporting legs vertically disposed on the heat dissipation body;
- bonding the supporting legs to the carrier structure to form a packaging space between the heat dissipation body and the carrier structure, wherein the supporting legs are formed with accommodation ports coated with a bonding material to engage with protruding portions of the carrier structure, wherein the electronic component is located in the packaging space;
- and
- forming a heat dissipation material in the packaging space to completely encapsulate the electronic component, wherein the electronic component is free from being exposed from the heat dissipation material.
1 more element
Dependencies are inferred from the claim text.