Method for injection molded flip chip encapsulation

A method for encapsulating and reinforcing the electrical interconnections of an integrated circuit chip assembly, comprising the steps of:

• providing a substrate having an opening extending from a remote surface of said substrate to a mounting surface of said substrate and an integrated circuit chip having an attachment surface and a remote surface;
• said attachment surface of said integrated circuit chip being attached above said opening to said mounting surface of said substrate in a standoff relationship thereby defining a space therebetween, said space having a height of about 0.002 to 0.006 inches;
• placing a mold over said integrated circuit chip, said mold having at least one vent extending from an inner surface of said mold to an outer surface of said mold, said inner surface of said mold facing said remote surface of said integrated circuit chip in a standoff relationship, thereby defining a void;
• providing a volume of an encapsulant necessary to substantially fill said space and said void;
• dispensing said volume of said encapsulant through said opening into said space and said void;
• and
• curing said encapsulant to form a bond between said substrate and said integrated circuit chip.