Method of forming interface between die and chip carrier
AssigneeTessera, Inc.
InventorsJason Sweis, Kenneth B. Gilleo
Life of this patent
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Abstract
A method for creating an interface between a chip and chip carrier includes spacing the chip a given distance above the chip carrier, and then introducing a liquid in the gap between the chip and carrier. Preferably, the liquid is an elastomer which is hardened into a resilient layer after its introduction into the gap. In another preferred embodiment, the terminals on a chip carrier are planarized or otherwise vertically positioned by deforming the terminals into set vertical locations with a plate, and then hardening a liquid between the chip carrier and chip.
Claims39
A method of forming a mounting structure for a semiconductor chip comprising the steps of
- providing a flexible chip carrier having a top surface and a bottom surface terminals disposed on said top surface and leads in electrical connection with said terminals,
- placing said chip carrier a given distance above said chip to create a gap between said chip carrier and said chip, said bottom surface facing said chip;
- bonding said leads to said chip;
- and
- introducing a liquid into said gap, such that said liquid is disposed between said chip carrier and said chip.
A method of forming a mounting structure for a semi-conductor chip comprising the steps of
- placing a chip carrier a given distance above said chip to create a gap between said chip carrier and said chip
- introducing a hardenable elastomer liquid into said gap, such that said liquid is disposed between said chip carrier and said chip;
- and
- hardening said liquid after said liquid has been introduced into said gap to thereby form a resilient layer in said gap, said hardening comprising curing said liquid by transmitting radiant energy towards said liquid.
A method of forming an elastomeric layer between a chip and a chip carrier having a top and bottom surface, terminals disposed on said top surface, and leads in electrical connection with said terminals, said method comprising the steps of
- placing said chip carrier a given distance above said chip to create a gap between said chip carrier and said chip, said bottom surface of said chip carrier facing said chip,
- bonding said leads to said chip,
- introducing a liquid elastomer into said gap, such that said liquid elastomer is disposed between said chip carrier and said chip, and
- hardening said liquid elastomer after said liquid elastomer has been introduced into said gap.
A method of forming an elastomeric layer between a chip and a chip carrier having leads, and terminals in electrical connection with said leads, said chip carrier including a support structure having a central portion bearing said terminals and a peripheral portion, said leads initially extending from said central portion to said peripheral portion, said method comprising the steps of
- placing said chip carrier a given distance above said chip to create a gap between said chip carrier and said chip, said placing including supporting said peripheral portion so that said central portion of said support structure lies above said chip;
- bonding said leads to said chip including detaching said leads from said peripheral portion and connecting said leads to said chip;
- introducing a liquid elastomer into said gap, such that said liquid elastomer is disposed between said chip carrier and said chip, and
- hardening said liquid elastomer after said liquid elastomer has been introduced into said gap.
A method of forming an elastomeric layer between a chip and a chip carrier having leads, and terminals in electrical connection with said leads, said method comprising the steps of
- placing said chip carrier a given distance above said chip to create a gap between said chip carrier and said chip,
- bonding said leads to said chip,
- introducing a liquid elastomer into said gap, such that said liquid elastomer is disposed between said chip carrier and said chip,
- hardening said liquid elastomer after said liquid elastomer has been introduced into said gap, said hardening including partially curing said liquid in an initial curing step and then finally hardening said partially cured liquid, and
- displacing said terminals to a preselected vertical location after said initial curing step and before said hardening step.
A method of positioning a plurality of terminals on one side of a flexible chip carrier layer, said method comprising the steps of
- disposing a partially cured layer of flowable material between said chip carrier layer and a chip such that said layer of flowable material is disposed beneath said flexible layer and said terminals extend upwardly from said flexible layer away from said layer if flowable material,
- pushing said terminals towards said chip with a molding plate until the tips of said terminals define a surface which substantially conforms to the shape of said molding plate,
- hardening said layer of flowable material after said pushing step while said terminals are defining said surface.
A method of forming a mounting structure for a semi-conductor chip comprising the steps of
- placing a chip carrier having outer edges a given distance above said chip to create a gap between said chip carrier and said chip;
- introducing a hardenable elastomer liquid into said gap, such that said liquid is disposed between said chip carrier and said chip;
- hardening said liquid after said liquid has been introduced into said gap to thereby form a resilient layer in said gap;
- and
- ceasing said introducing step when an amount of liquid sufficient to reach said outer edges of said chip carrier has been introduced.
A method of forming an elastomeric layer between a chip and a chip carrier having leads, and terminals in electrical connection with said leads, said method comprising the steps of
- placing said chip carrier a given distance above said chip to create a gap between said chip carrier and said chip,
- bonding said leads to said chip,
- introducing a liquid elastomer into said gap, such that said liquid elastomer is disposed between said chip carrier and said chip,
- hardening said liquid elastomer after said liquid elastomer has been introduced into said gap, and
- controlling said vertical location of said terminals by placing a plate adjacent said terminals before said introducing step, such that the introduction of said liquid within said gap forces said terminals upward against said plate.
Dependencies are inferred from the claim text.