Semiconductor module and method for manufacturing semiconductor module

A semiconductor module comprising:

• a case having an inner wall defining a space where a plurality of switching elements are arranged and a peripheral edge portion outside the inner wall and having a rectangular annular shape;
• a pair of long side portions forming a part of the peripheral edge portion and facing each other, the pair of long side portions including a first long side portion having an intermediate terminal connected to the plurality of switching elements, and the intermediate terminal including a fastening surface to which a cable connected to a load as a drive target is fastenable;
• a structure in a partial region of the inner wall adjacent to the first long side portion and extended above the fastening surface;
• and
• a sealing section including an epoxy resin in the space and configured to seal the plurality of switching elements in the space, the sealing section having weld lines on an upper surface of the sealing section and that are closer to the first long side portion than to a second long side portion of the pair of long side portions so as to be on a side of the space adjacent to the structure.