Semiconductor component with damped bonding surfaces in a package with encapsulated pins
AssigneeSiemens Aktiengesellschaft
InventorsBernd Kürten, Daniel Kappauf
Life of this patent
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Abstract
A housing part for accommodating a semiconductor element includes a pin partially molded in the housing part for electrical connection to a printed circuit board. The pin includes a bonding surface for producing an electrical connection between the pin and the semiconductor element. The housing part includes a bearing surface for the bonding surface and a recess formed in the bearing surface or adjoining the bearing surface. A vibration-damping material is at least partially filled in the recess and/or applied in a region adjoining the recess. The housing part is designed as a one-piece housing frame part.
Claims20
A housing part for accommodating a semiconductor element, the housing part comprising:
- a pin partially molded in the housing part for electrical connection to a printed circuit board, said pin comprising a bonding surface for producing an electrical connection between the pin and the semiconductor element;
- a bearing surface for the bonding surface, wherein the housing part comprises the bearing surface for the bonding surface;
- a recess formed in the bearing surface, wherein the housing part has the recess in the bearing surface;
- and
- a vibration-damping material at least partially filled in the recess and/or applied in a region adjoining the recess,
- wherein the housing part is designed as a one-piece housing frame part.
A semiconductor component, comprising:
- a semiconductor element;
- and
- a housing part accommodating the semiconductor element and comprising a pin partially molded in the housing part for electrical connection to a printed circuit board, said pin comprising a bonding surface for producing an electrical connection between the pin and the semiconductor element, a bearing surface for the bonding surface, wherein the housing part comprises the bearing surface for the bonding surface, a recess formed in the bearing surface, wherein the housing part has the recess in the bearing surface, and a vibration-damping material at least partially filled in the recess and/or applied in a region adjoining the recess, wherein the housing part is designed as a one-piece housing frame part.
A method, comprising:
- at least partially molding a pin in a housing part for electrical connection to a printed circuit board;
- electrically connecting a bonding surface on the pin between the pin and a semiconductor element;
- forming a bearing surface for the bonding surface, wherein the housing part comprises the bearing surface for the bonding surface;
- forming a recess in the bearing surface, wherein the housing part has the recess in the bearing surface;
- at least partially filling the recess with a vibration-damping material and/or applying the vibration-damping material in a region adjoining the recess,
- wherein the housing part is designed as a one-piece housing frame part.
Dependencies are inferred from the claim text.