Integrated circuit package
AssigneeSTMicroelectronics International N.V.
InventorsAsma HAJJI, Ouafa HAJJI, Fabien QUERCIA, Younes BOUTALEB
Life of this patent
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Abstract
The manufacture of an electronic device includes a step a) of providing an assembly including a chip and an interconnection substrate, where the chip has a first surface with connection areas and a second surface, where the connection areas are assembled on the interconnection substrate by contact pads, and wherein the chip is encapsulated in a molding compound, for example an epoxy molding compound, that leaves the second surface of the chip accessible. A lid is assembling on the molding compound with a gap between the lid and the accessible second surface of the chip. A thermally-conductive resin is injected to fill the gap between the lid and the second surface of the chip.
Claims20
A method of manufacturing an electronic device, comprising the following steps:
- a) providing an assembly comprising an integrated circuit chip and an interconnection substrate, wherein the integrated circuit chip has a first surface covered by connection areas and a second surface, wherein the connection areas are assembled on the interconnection substrate by contact pads, and wherein the integrated circuit chip is encapsulated in a molding compound which leaves the second surface of the integrated circuit chip accessible;
- b) assembling a lid on the assembly provided at step a), wherein there is a gap between the lid and the accessible second surface of the integrated circuit chip;
- and
- c) injecting a thermally-conductive resin to fill the gap between the lid and the accessible second surface of the integrated circuit chip.
An electronic device, comprising:
- an interconnection substrate;
- an integrated circuit chip having a first surface covered by connection areas and a second surface, wherein the connection areas are mounted to the interconnection substrate by contact pads;
- a molding compound encapsulating the integrated circuit chip, wherein the second surface of the integrated circuit chip is exposed at a back surface of the molding compound;
- a lid covering the second surface of the integrated circuit chip;
- and
- a thermally-conductive resin filling a space between the lid and the second surface of the integrated circuit chip.
Dependencies are inferred from the claim text.