Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same

A semiconductor device package, comprising

• a carrier having a top surface;
• an electronic component disposed on the top surface of the carrier;
• at least two conductive elements disposed on the top surface of the carrier;
• a package body disposed on the top surface of the carrier and encapsulating the electronic component and a portion of each of the conductive elements;
• a shield disposed on the package body and covering an exterior of the package body;
• a magnetic insulating layer disposed on a top surface of the shield;
• and
• a patterned conductive layer disposed on the magnetic insulating layer,
• wherein each of the conductive elements electrically connects the patterned conductive layer to the electronic component;
• and
• wherein the shield comprises multiple non-magnetic conductive layers, multiple insulating layers and multiple magnetic conductive layers, and wherein at least one of the insulating layers is located between each non-magnetic conductive layer and a neighboring magnetic conductive layer.