H10W 78/00
Detachable holders for supporting packaged chips in operation
H10W78/00 (Detachable holders for supporting packaged chips in operation) appears on 557 US grants and 430 published applications in this corpus.
Search patents in H10W- Granted patents
- 557
- Published applications
- 430
- Assignees
- 252
- Inventors
- 1,102
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 3 | 0 |
| 1978 | 6 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 4 | 0 |
| 1982 | 2 | 0 |
| 1983 | 7 | 0 |
| 1984 | 3 | 0 |
| 1985 | 6 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 5 | 0 |
| 1991 | 4 | 0 |
| 1992 | 12 | 0 |
| 1993 | 3 | 0 |
| 1994 | 7 | 0 |
| 1995 | 9 | 0 |
| 1996 | 8 | 0 |
| 1997 | 8 | 0 |
| 1998 | 18 | 0 |
| 1999 | 21 | 0 |
| 2000 | 29 | 0 |
| 2001 | 14 | 8 |
| 2002 | 17 | 13 |
| 2003 | 20 | 11 |
| 2004 | 16 | 19 |
| 2005 | 13 | 8 |
| 2006 | 11 | 14 |
| 2007 | 9 | 11 |
| 2008 | 2 | 5 |
| 2009 | 7 | 3 |
| 2010 | 4 | 4 |
| 2011 | 5 | 6 |
| 2012 | 6 | 14 |
| 2013 | 3 | 10 |
| 2014 | 10 | 15 |
| 2015 | 15 | 14 |
| 2016 | 14 | 16 |
| 2017 | 19 | 25 |
| 2018 | 19 | 29 |
| 2019 | 30 | 36 |
| 2020 | 31 | 33 |
| 2021 | 23 | 31 |
| 2022 | 26 | 29 |
| 2023 | 19 | 25 |
| 2024 | 26 | 24 |
| 2025 | 18 | 22 |
| 2026 | 6 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device and power converter22 Sep 2026US 12,745,654 B2Mitsubishi Electric Corporation
- Bumps comprising tin, cooper and bismuth for liquid metal socket interconnects4 Aug 2026US 12,702,042 B2Intel Corporation
- Semiconductor device and method of forming thereof14 Jul 2026US 12,685,057 B2Yangtze Memory Technologies Co., Ltd.
- Quantum device19 May 2026US 12,635,424 B2NEC Corporation
- Reversible attachment micro connector3 Feb 2026US 12,542,389 B2The Boeing Company
- Cold plate and electronic device13 Aug 2026US 2026/0239981 A1Wiwynn Corporation
- Device packages with embedded cooling assemblies23 Jul 2026US 2026/0215268 A1Adeia Semiconductor Bonding Technologies Inc.
- Quantum device11 Jun 2026US 2026/0165037 A1Fujitsu Limited
- Wiring board for mounting semiconductor device, method for producing wiring board, and semiconductor device26 Feb 2026US 2026/0060116 A1Toppan Holdings Inc.
- Semiconductor device with a dielectric spacer and method of manufacturing8 Jan 2026US 2026/0011627 A1Infineon Technologies Austria AG
Most cited
By later US patents
- Cassette holder assembly for a substrate cassette and holding member for use in such assembly423US 10,249,524 B2ASM IP Holding B. V. · 2019
- Compressive bump-and-socket interconnection scheme for integrated circuits256US 5,329,423 A1994
- Method for mounting a microelectronic circuit peripherally-leaded package including integral support member with spacer201US 5,673,479 ALSI Logic Corporation · 1997
- Packaging system for stacking integrated circuits194US 4,862,249 AXOC Devices, Inc. · 1989
- Flexible connectors for microelectronic elements192US 6,086,386 ATessera, Inc. · 2000