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US 12,702,042 B2Granted
Bumps comprising tin, cooper and bismuth for liquid metal socket interconnects
AssigneeIntel Corporation
InventorsJiaqi Wu, Xiao Lu, Bohan Shan, Valery Ouvarov-Bancalero
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Abstract
In one embodiment, an integrated circuit apparatus comprises a substrate that includes electrical contacts on a first side of the substrate to couple the substrate to an integrated circuit die, a passivation layer on a second side of the substrate opposite the first side, metal pads on the second side of the substrate and within openings defined by the passivation layer, and solder bumps on the metal pads. The solder bumps are a material that is resistant to Gallium-based liquid metal embrittlement.
Claims15
An apparatus comprising:
- a substrate comprising:
- electrical contacts on a first side of the substrate to couple the substrate to an integrated circuit die;
- a passivation layer on a second side of the substrate opposite the first side, the passivation layer defining a plurality of openings exposing the second side of the substrate;
- metal pads on the second side of the substrate and within the openings defined by the passivation layer;
- and
- solder bumps on the metal pads, the solder bumps comprising an intermetallic compound (IMC) resistant to Gallium-based liquid metal embrittlement, wherein the IMC comprises Tin and Copper and the solder bumps comprise between 20-40% Tin, 20-40% Copper, and 20-40% Bismuth.
3 more elements
A system comprising:
- a main board;
- a socket coupled to the main board, the socket comprising a set of pins extending from the socket in a direction opposite the main board;
- a package coupled to the socket, the package comprising:
- a substrate;
- an integrated circuit die on a first side of the substrate;
- metal pads on a second side of the substrate opposite the first side;
- solder bumps on the metal pads, the solder bumps comprising an intermetallic compound (IMC) resistant to Gallium-based liquid metal embrittlement, wherein the IMC comprises Tin and Copper and the solder bumps comprise between 20-40% Tin, 20-40% Copper, and 20-40% Bismuth;
- and
- an interposer comprising a Gallium-based liquid metal in each of a set of reservoirs defined within the interposer, the Gallium-based liquid metal in each reservoir in contact with a respective solder bump;
- wherein the pins of the socket are within the reservoirs of the interposer and in contact with the Gallium-based liquid metal.
7 more elements
An apparatus comprising:
- a substrate comprising:
- electrical contacts on a first side of the substrate to couple the substrate to an integrated circuit die;
- a dielectric layer on a second side of the substrate opposite the first side, the dielectric layer defining a plurality of openings exposing the second side of the substrate;
- metal pads on the second side of the substrate and within the openings defined by the dielectric layer;
- and
- solder bumps on the metal pads, the solder bumps comprising an intermetallic compound (IMC) comprising Tin and Copper and further comprising Bismuth, wherein the solder bumps comprise between 20-40% Tin, 20-40% Copper, and 20-40% Bismuth.
3 more elements
A product made by a process comprising:
- forming a substrate;
- forming electrical contacts on a first side of the substrate;
- forming a passivation layer on a second side of the substrate opposite the first side;
- forming openings in the passivation layer exposing the second side of the substrate;
- forming metal pads on the second side of the substrate within the openings in the passivation layer;
- depositing solder paste on the metal pads, the solder paste comprising Tin, Copper, and Bismuth, wherein the solder paste comprises between 20-40% Tin, 20-40% Copper, and 20-40% Bismuth;
- and
- exposing the solder paste to gas comprising Nitrogen and heat to form an intermetallic compound comprising Tin and Copper.
5 more elements
Dependencies are inferred from the claim text.