Compressive bump-and-socket interconnection scheme for integrated circuits

An electrically and mechanically interconnected assembly comprising,

• a substrate having a first pattern of contact sites on a first surface of said substrate,
• an integrated circuit chip having a second pattern of input/output pads on an active side of said integrated circuit chip, said second pattern being aligned with said first pattern,
• demountable means for electrically connecting said contact sites to said input/output pads, said demountable means including a bump-and-socket arrangement wherein a first one of said first and second patterns has electrically conductive raised bumps and wherein a second one of said first and second patterns has depressions to receive said raised bumps therein, said raised bumps being friction fit to said depressions, and
• depression means for maintaining said raised bumps within said depressions, said depression means for maintaining providing force to press said raised bumps into said depressions, said depression means for maintaining being disposed to apply said force to at least one of a surface opposite said first surface of said substrate and to a surface opposite to said active side of said integrated circuit chip, wherein said substrate and said integrated circuit chip are pressed together,
• said raised bumps having a geometry to limit the entry of said raised bumps into said depressions, said raised bumps thereby being spaced apart from the bottoms of said depressions.

An electrically and mechanically connected assembly comprising,

• an integrated circuit chip having a plurality of input/output pads disposed upon a surface thereof, said integrated circuit chip having a first external surface opposite to said surface containing said plurality of said input/output pads,
• a substrate having a plurality of contact sites, each contact site being aligned with an input/output pad, said substrate having a second external surface opposite to the surface containing said plurality of said contact sites.
• bump-and-socket arrangement electrically coupling said input/output pads to said contact sites, each bump-and-socket arrangement including a conductive raised bump received within a socket, and
• pressure means for maintaining said raised bumps within said sockets, said pressure means applying force on each of said first and second external surfaces, each bump-and-socket arrangement being deformed by said force, said raised bumps being removable form said sockets at a temperature below a melting point of said raised bumps upon removal of said pressure means.