Wiring board for mounting semiconductor device, method for producing wiring board, and semiconductor device

Abstract

An object of the present invention is to provide a wiring board for mounting a semiconductor device capable of increasing the design flexibility of a 3D multilayer structure and method for producing the wiring board. One aspect is a wiring board for mounting a semiconductor device. The wiring board includes a first connection terminal area and a second connection terminal area on a semiconductor device mounting surface, in which the first connection terminal area includes a first connection terminal including a first connection pad and a solder bump, the second connection terminal area includes a second connection terminal including a second connection pad and a solder bump, and the first connection pad is covered by a solder resist layer on its side surface and a part of the top surface, whereas the second connection pad is not covered by a solder resist layer on its side surface and top surface.

Dependencies are inferred from the claim text.