Semiconductor device and power converter
AssigneeMitsubishi Electric Corporation
InventorsHodaka Rokubuichi, Yasuyuki Sanda, Kei Yamamoto
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Abstract
A semiconductor device includes a lead frame having a mount surface, a semiconductor element disposed on the mount surface, a circuit board disposed apart from the mount surface in a thickness direction of the semiconductor device and electrically connected to the lead frame, a sealing resin that seals the lead frame, the semiconductor element, and the circuit board, and a connector. The lead frame has a lead exposed from the sealing resin. The circuit board has at least one exposed portion exposed from the sealing resin. A connector is electrically connected to one of the at least one exposed portion.
Claims13
A semiconductor device comprising:
- a lead frame having a mount surface;
- a semiconductor element disposed on the mount surface;
- a circuit board disposed apart from the mount surface in a thickness direction of the semiconductor device and electrically connected to the lead frame;
- a sealing resin to seal the lead frame, the semiconductor element, and the circuit board;
- and
- a connector having a terminal portion, wherein
- the lead frame includes a lead exposed from the sealing resin,
- the circuit board has at least one exposed portion exposed from the sealing resin, and
- the terminal portion of the connector is exposed from the sealing resin and the terminal portion is electrically connected to one of the at least one exposed portion.
Dependencies are inferred from the claim text.