Semiconductor device and method of forming thereof
AssigneeYangtze Memory Technologies Co., Ltd.
InventorsQingyi Huang, Lina Miao
Life of this patent
Estimating the term…
Abstract
The present disclosure provides a semiconductor device and a preparation method thereof. The semiconductor device includes a body structure and an outer edge structure at a periphery of a bottom of the body structure. The body structure includes a top surface and a bottom surface arranged opposite to each other, and a side surface between the top surface and the outer edge structure. The side surface includes a first side surface connected with the outer edge structure, and a lateral distance of the first side surface relative to the outer edge structure gradually decreases along a direction from the top surface to the bottom surface.
Claims19
A semiconductor device, comprising:
- a body structure;
- and
- an outer edge structure at a periphery of a bottom of the body structure,
- wherein the body structure comprises a top surface and a bottom surface arranged opposite to each other, and a side surface between the top surface and the outer edge structure,
- wherein the side surface comprises a first side surface connected with the outer edge structure,
- wherein a lateral distance of the first side surface relative to the outer edge structure gradually decreases along a direction from the top surface to the bottom surface, and
- wherein the outer edge structure comprises:
- a first surface connected with the side surface;
- and
- a second surface parallel to the first surface and coplanar with the bottom surface of the body structure,
- wherein the first side surface is an inclined surface, and
- wherein an angle between the inclined surface and the first surface is an obtuse angle.
A method of forming a semiconductor device, comprising:
- forming a body structure and an outer edge structure at a periphery of a bottom of the body structure;
- and
- sticking an adhesive tape on the body structure and the outer edge structure,
- wherein the body structure comprises a top surface and a bottom surface arranged opposite to each other, and a side surface between the top surface and the outer edge structure,
- wherein the side surface comprises a first side surface proximate to the outer edge structure,
- wherein the first side surface comprises a curved surface, and
- wherein a lateral distance of the first side surface relative to the outer edge structure gradually decreases along a direction from the top surface to the bottom surface.
A method of forming a semiconductor device, comprising:
- providing a carrier and an outer edge structure at a side wall of the carrier;
- forming a device structure on the carrier, the carrier and the device structure forming a body structure;
- trimming an edge of the body structure to form a side surface;
- and
- sticking an adhesive tape on the body structure and the outer edge structure,
- wherein the body structure comprises a top surface and a bottom surface arranged opposite to each other,
- wherein the side surface is positioned between the top surface and the outer edge structure,
- wherein the side surface comprises a first side surface proximate to the outer edge structure, and
- wherein a lateral distance of the first side surface relative to the outer edge structure gradually decreases along a direction from the top surface to the bottom surface.
Dependencies are inferred from the claim text.