Bonding head and bonding apparatus

A bonding head comprising:

• a main body through which a laser duct extends from a laser entry to a laser exit;
• a laser source that directs a laser beam through the laser duct towards the laser exit;
• a holding nozzle connected to the main body, wherein a nozzle duct extends through the holding nozzle from a nozzle entry to a nozzle exit, wherein the nozzle entry is adjacent to the laser exit;
• a vacuum source configured to create a vacuum in the nozzle duct, wherein a vacuum/pressure channel extends through the main body from the vacuum source to the laser duct, wherein the holding nozzle is configured to hold a substrate at the nozzle exit when the vacuum source creates the vacuum in the nozzle duct, and wherein the laser beam passes through the nozzle duct and is directed towards the substrate;
• and
• a pressure source configured to introduce a pressurized gas into the laser duct via the vacuum/pressure channel when the substrate is being held at the nozzle exit and the laser beam is being directed towards the substrate, wherein the holding nozzle is configured to hold the substrate over a mounting face of a second substrate such that when the pressurized gas is introduced into the laser duct, the substrate is pressed against the mounting face of the second substrate.