H10W 40/00
Arrangements for thermal protection or thermal control
Official title: Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60)
H10W40/00 (Arrangements for thermal protection or thermal control) appears on 27,170 US grants and 33,280 published applications in this corpus.
Search patents in H10W- Granted patents
- 27,170
- Published applications
- 33,280
- Assignees
- 4,711
- Inventors
- 41,175
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 35 | 0 |
| 1977 | 41 | 0 |
| 1978 | 51 | 0 |
| 1979 | 33 | 0 |
| 1980 | 36 | 0 |
| 1981 | 37 | 0 |
| 1982 | 33 | 0 |
| 1983 | 44 | 0 |
| 1984 | 37 | 0 |
| 1985 | 59 | 0 |
| 1986 | 57 | 0 |
| 1987 | 81 | 0 |
| 1988 | 67 | 0 |
| 1989 | 103 | 0 |
| 1990 | 103 | 0 |
| 1991 | 150 | 0 |
| 1992 | 133 | 0 |
| 1993 | 149 | 0 |
| 1994 | 225 | 0 |
| 1995 | 216 | 0 |
| 1996 | 248 | 0 |
| 1997 | 272 | 0 |
| 1998 | 395 | 0 |
| 1999 | 413 | 0 |
| 2000 | 443 | 0 |
| 2001 | 539 | 175 |
| 2002 | 607 | 615 |
| 2003 | 611 | 760 |
| 2004 | 649 | 958 |
| 2005 | 603 | 1119 |
| 2006 | 720 | 1148 |
| 2007 | 738 | 1267 |
| 2008 | 661 | 1115 |
| 2009 | 637 | 1087 |
| 2010 | 771 | 1036 |
| 2011 | 714 | 941 |
| 2012 | 651 | 990 |
| 2013 | 720 | 1102 |
| 2014 | 777 | 1207 |
| 2015 | 918 | 1182 |
| 2016 | 1037 | 1230 |
| 2017 | 1045 | 1289 |
| 2018 | 1166 | 1350 |
| 2019 | 1317 | 1575 |
| 2020 | 1279 | 1764 |
| 2021 | 1272 | 1808 |
| 2022 | 1274 | 1812 |
| 2023 | 1278 | 1971 |
| 2024 | 1424 | 2128 |
| 2025 | 1397 | 2073 |
| 2026 | 904 | 1578 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 40/20Arrangements for cooling15,147
- H10W 40/70Fillings or auxiliary members in containers or in encapsulations for thermal protection8,539
- H10W 40/40Involving heat exchange by flowing fluids6,213
- H10W 40/10Arrangements for heating3,875
- H10W 40/60Securing means for detachable heating or cooling arrangements3,807
- H10W 40/01Manufacture or treatment1,296
- H10W 40/30Wherein the packaged device is completely immersed in a fluid other than302
- H10W 40/50Arrangements for sensing temperature0
All 9 subgroupsShow fewer
Recent patents
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- Modular vapor chamber and connection of segments of modular vapor chamber6 Oct 2026US 12,757,354 B2Intel Corporation
- Vehicle-mounted power supply apparatus with upper and lower cooling channels and vehicle6 Oct 2026US 12,757,361 B2Huawei Digital Power Technologies Co., Ltd.
- Heterogeneous packaging integration of photonic and electronic elements8 Oct 2026US 2026/0309942 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Multilayer back plate with molded ceramic layer8 Oct 2026US 2026/0313849 A1Intel Corporation
- Method to improve interconnect coefficient of thermal expansion8 Oct 2026US 2026/0314357 A1APPLIED Materials.Inc.
- Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly8 Oct 2026US 2026/0314397 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device8 Oct 2026US 2026/0314398 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method for fabricating an integrated circuit module849US 5,353,498 AGeneral Electric Company · 1994
- Semiconductor device in a resin package housed in a frame having high thermal conductivity660US 5,625,222 AFujitsu Limited · 1997
- Semiconductor device having a pad array carrier package626US 5,216,278 AMotorola, Inc. · 1993
- Direct build-up layer on an encapsulated die package600US 6,271,469 B1Intel Corporation · 2001
- Fan-out package structure and methods for forming the same595US 8,803,306 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2014