H10W 40/60
Securing means for detachable heating or cooling arrangements
Official title: Securing means for detachable heating or cooling arrangements, e.g. clamps
H10W40/60 (Securing means for detachable heating or cooling arrangements) appears on 3,807 US grants and 3,834 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,807
- Published applications
- 3,834
- Assignees
- 1,031
- Inventors
- 7,024
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 10 | 0 |
| 1977 | 16 | 0 |
| 1978 | 16 | 0 |
| 1979 | 10 | 0 |
| 1980 | 13 | 0 |
| 1981 | 13 | 0 |
| 1982 | 10 | 0 |
| 1983 | 13 | 0 |
| 1984 | 8 | 0 |
| 1985 | 22 | 0 |
| 1986 | 20 | 0 |
| 1987 | 31 | 0 |
| 1988 | 14 | 0 |
| 1989 | 21 | 0 |
| 1990 | 17 | 0 |
| 1991 | 22 | 0 |
| 1992 | 25 | 0 |
| 1993 | 22 | 0 |
| 1994 | 40 | 0 |
| 1995 | 39 | 0 |
| 1996 | 38 | 0 |
| 1997 | 46 | 0 |
| 1998 | 68 | 0 |
| 1999 | 75 | 0 |
| 2000 | 76 | 0 |
| 2001 | 110 | 23 |
| 2002 | 148 | 66 |
| 2003 | 109 | 91 |
| 2004 | 107 | 142 |
| 2005 | 82 | 139 |
| 2006 | 96 | 137 |
| 2007 | 122 | 179 |
| 2008 | 132 | 183 |
| 2009 | 135 | 187 |
| 2010 | 142 | 173 |
| 2011 | 96 | 139 |
| 2012 | 82 | 89 |
| 2013 | 71 | 142 |
| 2014 | 79 | 153 |
| 2015 | 93 | 119 |
| 2016 | 101 | 128 |
| 2017 | 117 | 124 |
| 2018 | 146 | 157 |
| 2019 | 140 | 165 |
| 2020 | 156 | 203 |
| 2021 | 149 | 193 |
| 2022 | 139 | 187 |
| 2023 | 149 | 201 |
| 2024 | 165 | 259 |
| 2025 | 174 | 139 |
| 2026 | 82 | 116 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- High voltage distribution box with heat sink6 Oct 2026US 12,756,162 B2Sumitomo Wiring Systems, Ltd.
- Package structures and methods of manufacturing the same6 Oct 2026US 12,757,734 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Systems and methods for an interlocking feature on a power module22 Sep 2026US 12,745,368 B2BorgWarner US Technologies LLC
- Systems and methods for active discharge for inverter for electric vehicle22 Sep 2026US 12,745,369 B2BorgWarner US Technologies LLC
- Wiring board8 Sep 2026US 12,733,092 B2Dai Nippon Printing Co.Ltd.
- Multilayer back plate with molded ceramic layer8 Oct 2026US 2026/0313849 A1Intel Corporation
- Power module with heat sink and cooling jacket1 Oct 2026US 2026/0304714 A1STMicroelectronics International N. V.
- Semiconductor Device17 Sep 2026US 2026/0282915 A1Hitachi Astemo, Ltd.
- Semiconductor structure including a guard ring and methods for forming the same17 Sep 2026US 2026/0282918 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic devices and methods of manufacturing electronic devices17 Sep 2026US 2026/0283000 A1Amkor Technology Singapore Holding Pte.Ltd.
Most cited
By later US patents
- Heat sink for cooling a heat producing element and application411US 5,504,650 AFujitsu Limited · 1996
- Cooling cover for RF power devices341US 5,428,504 AMotorola, Inc. · 1995
- Semiconductor device including cladded base plate274US 8,963,321 B2Infineon Technologies AG · 2015
- Method for mounting a microelectronic circuit peripherally-leaded package including integral support member with spacer201US 5,673,479 ALSI Logic Corporation · 1997
- Method of packaging and powering integrated circuit chips and the chip assembly formed thereby175US 4,954,878 ADigital Equipment Corporation · 1990