Semiconductor Device

Abstract

A semiconductor device includes: a plurality of semiconductor modules each incorporating a power semiconductor element and having a heat dissipation surface; a radiator in thermal contact with the heat dissipation surfaces of the plurality of semiconductor modules arrayed in a line; and a fixing member that fixes the radiator so as to press the radiator against the heat dissipation surfaces, in which the radiator includes a heat dissipation base portion pressed against the heat dissipation surfaces of the semiconductor modules, and a plurality of fixing flange portions each having a cantilever shape formed along a direction of the array integrally with the heat dissipation base portion and having flexural rigidity smaller than flexural rigidity of the heat dissipation base, and the fixing member fixes the radiator so as to elastically deform the fixing flange portion and press the heat dissipation base portion against the heat dissipation surfaces of the semiconductor modules by an elastic force of the fixing flange portion.

Dependencies are inferred from the claim text.