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US 12,757,734 B2Granted
Package structures and methods of manufacturing the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Kuo-Chung Yee, Tin-Hao Kuo
Life of this patent
Estimating the term…
Abstract
A package structure includes a first die, an encapsulant and a securing element. The encapsulant encapsulates the first die. The securing element penetrates through the encapsulant and a corner of the first die and electrically isolated from the first die.
Claims20
A package structure, comprising:
- a first die;
- an encapsulant encapsulating the first die;
- a redistribution structure disposed over and electrically connected to the first die, comprising a dielectric layer;
- a securing element, penetrating through the dielectric layer of the redistribution structure, the encapsulant and an outer peripheral edge corner of the first die and completely electrically isolated from the first die;
- and
- a plurality of solder regions, wherein the redistribution structure is electrically connected to and disposed between the plurality of solder regions and the first die.
3 more elements
A package structure, comprising:
- a first die encapsulated by an encapsulant;
- a redistribution structure over a first side of the first die, the redistribution structure comprising a dielectric layer and a plurality of redistribution conductive patterns in the dielectric layer;
- a screw, penetrating the dielectric layer of the redistribution structure, the encapsulant and an outer peripheral edge corner of the first die;
- and
- a seal ring in the dielectric layer, electrically insulated from the redistribution conductive patterns, wherein the seal ring comprises a plurality of first conductive layers and a plurality of first conductive vias between the plurality of first conductive layers.
2 more elements
A method of manufacturing a package structure, comprising:
- providing a package comprising a first die, an encapsulant encapsulating the first die and a redistribution structure disposed over and electrically connected to the package and comprising a dielectric layer, the package further comprises a seal ring;
- forming a first hole in the package, the first hole penetrating an outer peripheral edge corner of the first die and the dielectric layer of the redistribution structure;
- and
- inserting a securing element into the first hole, wherein the securing element is completely electrically isolated from the first die, and the seal ring is disposed between the securing element and the redistribution structure.
1 more element
Dependencies are inferred from the claim text.