Cooling cover for RF power devices
AssigneeMotorola, Inc.
InventorRavinder N. Bhatla
Life of this patent
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Abstract
A cooling cover for an RF power amplifier device having a mounting support, a first lead, and a heat generating die mounted on the first lead. The cooling cover is comprised of a body of a thermally conductive material and having a first surface and a second surface. A layer of thermally conductive and electrical non-conductive material is deposited upon the second surface of the cooling cover. When the cover is coupled to the mounting support, the first surface is in contact with the mounting support and the second surface is in contact with the first lead thereby providing a low resistance heat path between the heat generating die and mounting support.
Claims28
A cooling cover for an radio frequency RF power amplifier device having a mounting support, a first lead, and a die mounted on said first lead, said cover comprising:
- A) a body composed of a thermally conductive material and having a first surface and a second surface;
- and
- B) a layer of thermally conductive and electrically non-conductive material deposited upon said second surface such that when the cover is coupled between said mounting support and first lead, said first surface is in thermally conductive contact with said mounting support and said second surface is in thermally conductive and electrically non-conductive contact with said first lead via said layer.
A method of cooling a lead of an RF power amplifier device having a mounting support and an amplifier die mounted on the lead, such method comprising the steps of:
- A) providing a device cover, having a mounting support surface and a second surface, of a material having a relatively high rate of thermal conductivity;
- B) depositing, along the second surface of the cover, a relatively thin layer of a material having a relatively high rate of thermal conductivity and low rate of electrical conductivity, thereby creating a lead surface;
- and,
- C) attaching the mounting support surface to the mounting support and the lead surface to the lead thereby cooling the lead.
A apparatus for cooling a lead of an RF power amplifier device having a mounting support and an amplifier die mounted on the lead, the apparatus comprising:
- A) a device cover, having a mounting support surface and a second surface, of a material having a relatively high rate of thermal conductivity;
- B) a relatively thin layer of a material having a relatively high rate of thermal conductivity and low rate of electrical conductivity deposited along the second surface of the cover thereby creating a lead surface;
- and,
- C) means for attaching the mounting support surface to the mounting support and the lead surface to the lead.
An apparatus for cooling a die of a radio frequency power amplifier, such apparatus comprising in combination:
- the die disposed on a first side of a first end of an electrically conductive lead:
- a metallic cover substantially covering the first side of the first end of the conductive lead and the die;
- and a layer of aluminum nitride of a thickness of substantially 0.030 inches disposed between the first lead and thermally conductive cover.
A method of cooling a die of a radio frequency power amplifier comprising the steps of:
- disposing the die on a first side of a first end of an electrically conductive lead:
- substantially covering the first side of the first end of the conductive lead and the die with a thermally conductive cover;
- and electrically isolating the first end of the electrically conductive lead from the thermally conductive cover by disposing a thermally conductive, electrically non-conductive material between the first lead and thermally conductive cover.
A power amplifier assembly including a power amplifier having at least a first electrical lead a cover and a mounting support, wherein the cover assembly comprises a thermally conductive body having a first and second surface and a electrically non-conductive thermal conductor layer deposited on the second surface, and wherein the layer is metallically attached to the first lead and the first surface is coupled to the mounting support such that the cover forms an electrically non-conductive thermal conductor between the first lead and mounting support.
Dependencies are inferred from the claim text.