Semiconductor structure including a guard ring and methods for forming the same

A method of making a semiconductor structure, the method comprising:

• forming a lower redistribution layer (RDL) structure including a lower RDL portion of a guard ring structure;
• forming a lower molded portion on the lower RDL structure, wherein the lower molded portion includes an interconnect die and a lower via portion of the guard ring structure;
• forming an upper RDL structure on the lower molded portion including an upper RDL portion of the guard ring structure;
• and
• forming a fastening hole in the lower RDL structure, the lower molded portion and the upper RDL structure such that the guard ring is around the fastening hole.

A packaging structure, comprising:

• a packaging substrate;
• a plurality of electronic modules on the packaging substrate;
• a semiconductor structure on a side of the packaging substrate opposite the plurality of electronic modules, wherein the semiconductor structure includes a lower molded portion including an interconnection die and a lower via portion of a guard ring;
• a thermal plate on the semiconductor structure;
• and
• a fastening member configured to fasten the thermal plate to the semiconductor structure and the packaging substrate, wherein the lower via portion of the guard ring is around the fastening member.