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US 12,745,368 B2Granted
Systems and methods for an interlocking feature on a power module
AssigneeBorgWarner US Technologies LLC
InventorEdward Choi
Life of this patent
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Abstract
A system includes a power module, wherein the power module includes a first interlocking feature on a first surface of the power module; and at least one heat sink, wherein the at least one heat sink includes a second interlocking feature on a surface of the at least one heat sink, wherein the surface of the at least one heat sink includes a layer of thermal interface material.
Claims16
A system comprising:
- a power module, wherein the power module includes a first interlocking feature on a first surface of the power module;
- and
- at least one heat sink, wherein the at least one heat sink includes a second interlocking feature on a surface of the at least one heat sink,
- wherein the first interlocking feature includes a height greater than a depth of the second interlocking feature to a form a uniform gap between the first surface of the power module and the surface of the at least one heat sink;
- wherein the surface of the at least one heat sink includes a layer of thermal interface material,
- wherein ideal locations for both the first interlocking feature and the second interlocking feature are determined by conducting finite element analysis, and
- wherein the thermal interface material includes a pattern including a dot, serpentine, or spiral.
4 more elements
A method for aligning a power module and a heat sink, the method comprising:
- forming a first interlocking feature on a surface of a power module;
- forming a second interlocking feature on a surface of a heat sink, wherein the first interlocking feature includes a height greater than a depth of the second interlocking feature;
- conducting finite element analysis to determine ideal locations for both the first interlocking feature and the second interlocking feature;
- applying a layer of thermal interface material on the surface of the heat sink or power module, wherein the thermal interface material includes a pattern including a dot serpentine, or spiral;
- and
- mating the first interlocking feature with the second interlocking feature, wherein a uniform gap is formed between the surface of the power module and the surface of the heat sink, wherein the thermal interface is applied uniformly to the gap.
3 more elements
Dependencies are inferred from the claim text.