H10W 40/625
Clamping parts not primarily conducting heat
Official title: {Clamping parts not primarily conducting heat}
H10W40/625 (Clamping parts not primarily conducting heat) appears on 349 US grants and 363 published applications in this corpus.
Search patents in H10W- Granted patents
- 349
- Published applications
- 363
- Assignees
- 195
- Inventors
- 893
- Latest grant
- 23 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 5 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 3 | 0 |
| 1998 | 5 | 0 |
| 1999 | 4 | 0 |
| 2000 | 4 | 0 |
| 2001 | 4 | 1 |
| 2002 | 11 | 5 |
| 2003 | 7 | 3 |
| 2004 | 6 | 8 |
| 2005 | 3 | 11 |
| 2006 | 8 | 21 |
| 2007 | 15 | 25 |
| 2008 | 23 | 36 |
| 2009 | 24 | 20 |
| 2010 | 22 | 21 |
| 2011 | 13 | 8 |
| 2012 | 10 | 4 |
| 2013 | 3 | 10 |
| 2014 | 5 | 11 |
| 2015 | 6 | 10 |
| 2016 | 6 | 8 |
| 2017 | 5 | 5 |
| 2018 | 11 | 10 |
| 2019 | 8 | 18 |
| 2020 | 12 | 17 |
| 2021 | 16 | 13 |
| 2022 | 17 | 17 |
| 2023 | 12 | 29 |
| 2024 | 20 | 21 |
| 2025 | 23 | 17 |
| 2026 | 5 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multilayer back plate with molded ceramic layer23 Jun 2026US 12,666,574 B2Intel Corporation
- Chip package with decoupled thermal management26 May 2026US 12,642,092 B2Xilinx, Inc.
- Fixing element for heat dissipation and method of mounting the same21 Apr 2026US 12,608,056 B2Asia Vital Components Co., Ltd.
- Display device with a heat dissipation substrate and a cover substrate7 Apr 2026US 12,599,038 B2Samsung Display Co., Ltd.
- Semiconductor module17 Feb 2026US 12,557,652 B2Fuji Electric Co., Ltd.
- Multilayer back plate with molded ceramic layer8 Oct 2026US 2026/0313849 A1Intel Corporation
- Electronic assembly, notably configured to be integrated in an inverter13 Aug 2026US 2026/0239582 A1Valeo eAutomotive Germany GmbH
- Methods and apparatus to protect integrated circuit packages and their interconnects from shock loads30 Jul 2026US 2026/0223671 A1Intel Corporation
- Methods and apparatus to apply load to a socketed integrated circuit package independent of a heatsink loading mechanism23 Jul 2026US 2026/0214805 A1Intel Corporation
- Sliding Thermal Interface Material (TIM) Assemblies16 Jul 2026US 2026/0206186 A1Laird Technologies, Inc.
Most cited
By later US patents
- Heat sink mounting arrangement for a semiconductor89US 4,707,726 AUnited Technologies Automotive, Inc. · 1987
- Repairable multi-level overlay system for semiconductor device84US 4,549,200 AInternational Business Machines Corporation · 1985
- Electronic package with a thermal interposer and method of manufacturing the same78US 7,781,883 B2International Business Machines Corporation · 2010
- Direct chip connection using demountable flip chip package77US 5,528,462 A1996
- Heat sink subassembly73US 6,639,800 B1Advanced Micro Devices, Inc. · 2003