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US 12,666,574 B2Granted
Multilayer back plate with molded ceramic layer
AssigneeIntel Corporation
InventorsPhil Geng, Ralph V. Miele, David Shia
Life of this patent
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Abstract
A molded ceramic layer of a multilayer cooling assembly back plate is described. The molded ceramic layer has an opening on a side of the molded ceramic layer that is to face a back side of a circuit board. The opening is aligned with a location of a back side component on the back side of the circuit board.
Claims20
An apparatus, comprising:
- a molded ceramic layer of a multilayer cooling assembly back plate, the molded ceramic layer comprising an opening on a side of the molded ceramic layer that is to face a back side of a circuit board, the opening aligned with a location of a back side component on the back side of the circuit board.
An apparatus, comprising:
- a multilayer back plate of a semiconductor chip cooling assembly, the multilayer back plate comprising a molded ceramic layer, the molded ceramic layer comprising an opening on a side of the molded ceramic layer that is to face a back side of a circuit board, the opening aligned with a location of a back side component on the back side of the circuit board.
An apparatus comprising, comprising:
- a cooling mass;
- a semiconductor chip package that is thermally coupled to the cooling mass;
- a circuit board, the circuit board comprising first I/Os, the semiconductor chip package comprising second I/Os that are coupled to the first I/Os;
- a bolster plate;
- a multilayer back plate, the circuit board between the bolster plate and the multilayer back plate, the bolster plate secured to the multilayer back plate to structurally support the circuit board, the multilayer back plate comprising a molded ceramic layer, the molded ceramic layer comprising an opening on a side of the molded ceramic layer that faces a back side of the circuit board, the opening aligned with a location of a back side component on the back side of the circuit board.
2 more elements
Dependencies are inferred from the claim text.