Semiconductor module

A semiconductor module, comprising:

• a semiconductor chip;
• a sealed main body portion sealing the semiconductor chip with a sealing material, the sealed main body portion being of a cuboid shape, and having a pair of attachment holes penetrating therethrough from a front surface thereof to a rear surface thereof;
• a heat dissipation plate, a main surface of which is in contact with the rear surface of the sealed main body portion, the heat dissipation plate being positioned under the semiconductor chip sealed by the sealed main body portion and between the pair of attachment holes in a plan view of the semiconductor module;
• and
• a pair of rear surface supporting portions protruding from the rear surface of the sealed main body portion, and corresponding respectively to the pair of attachment holes, both the heat dissipation plate and the pair of attachment holes being positioned, each in an entirety thereof, between respective parts of the pair of rear surface supporting portions in the plan view of the semiconductor module, the respective parts both facing toward the semiconductor chip in the plan view, or
• a pair of front surface supporting portions protruding from the front surface of the sealed main body portion, and corresponding respectively to the pair of attachment holes, each of the front surface supporting portions, except for an outermost portion thereof, being formed between the pair of attachment holes in the plan view of the semiconductor module.